On October 21, 2026, NVIDIA and supply chain partners unveiled their plans to broaden global manufacturing capacity through AI infra buildout so as to meet the growing demand when it comes to fast computing and a full-stack AI factory platform.
It is worth noting that collaborating with Amkor Technology, IBIDEN, King Yuan Electronics – KYEC, Samsung Electro-Mechanics, Siliconware Precision Industries – SPIL, and Unimicron Technology Corporation, NVIDIA is helping existing suppliers in expanding critical manufacturing capabilities in substrates, testing and optical engines, and advanced packaging, enhancing resiliency as well as redundancy across their global supply chain.
Says Jensen Huang, the founder and CEO of NVIDIA, “We are in the midst of the largest AI infra buildout in human history. Demand is extraordinary. Capacity is the constraint. Our supply chain partners are the world’s best manufacturers. I’m grateful they are expanding capacity around the globe to scale production and help us deliver the AI supercomputing systems powering this new industrial revolution.”
Increasing Substrate Capacity for Volume Growth
NVIDIA is going to grow substrate capacity for its products by 2.5 times in the coming three years. More are planned, and the below agreements are going to help with this level of capacity growth.
IBIDEN earlier in 2026 announced it had signed an agreement for a multibillion-dollar capacity reservation advance from NVIDIA so as to support its Ono Plant in Japan. The expansion is targeted to provide 3 times the current capacity at the plant, with further capacity scheduled to start ramping up in the Q1 of 2028.
Samsung Electro-Mechanics is joining the substrate supply chain from NVIDIA for immediate capacity from its current operations in South Korea. The partnership additionally endorses facility upgrades as well as new plants in Sejong and Busan, Korea. Samsung is expected to dedicate a sizable share of its yearly package substrate production capacity to NVIDIA by 2028.
NVIDIA has signed a capacity reservation agreement to support KF substrate manufacturing capacity expansion of Unimicron in Taiwan. The expansion is anticipated to start adding capacity in the Q2 of 2027, reaching full capacity by mid-2028.
Advanced Packaging for Future Platforms
Amkor and NVIDIA look forward to expanding Advanced Packaging Capacity in South Korea, hence in a way targeting over 300% growth when it comes to Interposer Wafer Capacity by 2028. Apparently, the planned capacity expansion and development of new manufacturing facilities by Amkor in South Korea will enable greater production volumes of the current and next-generation platforms from NVIDIA.
Strengthening US Manufacturing and Improving Semiconductor Testing
The company expects its overall semiconductor testing capacity to be doubled from calendar 2026 to 2027, backed up by expansions in the U.S. and Taiwan as well as Singapore.
NVIDIA’s $1.1 billion capacity reservation advance to KYEC will cover costs for new US testing facilities and equipment, with high-volume production planned for April 2027.
Expanded testing operations are projected to start high-volume production in Singapore in February 2027.
Building the Infrastructure for Co-Packaged Optics
NVIDIA and SPIL will boost manufacturing capacity for optical engines in Taiwan for co-packaged optics in order to meet the rising connectivity needs of large-scale computing facilities. The expansion is looking to grow 15 times by mid-2027 and another doubling by the end of 2028.
